advanced power n-channel enhancement mode electronics corp. power mosfet simple drive requirement bv dss 100v small package outline r ds(on) 300m surface mount device i d 1.5a rohs compliant & halogen-free description absolute maximum ratings symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w t stg t j symbol value unit rthj-a maximum thermal resistance, junction-ambient 3 90 /w data and specifications subject to change without notice operating junction temperature range -55 to 150 201307241 thermal data parameter 1 storage temperature range continuous drain current 3 , v gs @ 10v 1.2 pulsed drain current 1 6 total power dissipation 1.38 -55 to 150 gate-source voltage + 20 continuous drain current 3 , v gs @ 10v 1.5 parameter rating drain-source voltage 100 ap2348gn-hf halogen-free product g d s d g s sot-23 ap2348 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on- resistance and fast switching performance. it provides the designe r with an extreme efficient device for use in a wide range of powe r applications. the special design sot-23 package with good thermal performance is widely preferred for all commercial-industrial surface mount applications using infrared reflow technique and suited for voltage conversion or switch applications.
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =250ua 100 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =1a - - 300 m ? v gs =4.5v, i d =0.5a - - 600 m ? v gs(th) gate threshold voltage v ds =v gs , i d =250ua 1 - 3 v g fs forward transconductance v ds =10v, i d =1a - 1.6 - s i dss drain-source leakage current v ds =80v, v gs =0v - - 100 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =1a - 3 4.8 nc q gs gate-source charge v ds =50v - 1 - nc q gd gate-drain ("miller") charge v gs =4.5v - 1.5 - nc t d(on) turn-on delay time v ds =50v - 3 - ns t r rise time i d =1a - 19 - ns t d(off) turn-off delay time r g =3.3 ? -8- ns t f fall time v gs =10v - 20 - ns c iss input capacitance v gs =0v - 200 320 pf c oss output capacitance v ds =25v - 30 - pf c rss reverse transfer capacitance f=1.0mhz - 20 - pf source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =1a, v gs =0v - - 1.3 v t rr reverse recovery time i s =1a, v gs =0v, - 30 - ns q rr reverse recovery charge di/dt=100a/s - 12 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test 3.surface mounted on 1 in 2 copper pad of fr4 board t Q 10s ; 270 /w when mounted on min. copper pad. this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 2 ap2348gn-hf
ap2348gn-hf fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 2 4 6 8 10 0481216 v ds , drain-to-source voltage (v) i d , drain current (a) t a =25 o c 10v 7.0v 6.0v 5.0v v g = 4.0v 0 1 2 3 4 02468 v ds , drain-to-source voltage (v) i d , drain current (a) t a = 150 o c 10v 7.0v 6.0v 5.0v v g = 4.0v 0.4 0.8 1.2 1.6 2.0 2.4 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =1a v gs =10v 0 0.4 0.8 1.2 1.6 2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c 0.0 0.4 0.8 1.2 1.6 2.0 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) 200 240 280 320 360 400 246810 v gs gate-to-source voltage (v) r ds(on) (m ) i d =0.5a t a =25 o c i d =250ua
ap2348gn-hf fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. maximum continuous drain current fig 12. gate charge waveform v.s. ambient temperature 4 q v g 4.5v q gs q gd q g charge 0 2 4 6 8 012345 q g , total gate charge (nc) v gs , gate to source voltage (v) i d = 1a v ds =50v 0 100 200 300 400 1 5 9 1317212529 v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse p dm duty factor = t/t peak t j = p dm x r thja + t a r thja = 270 /w t t 0.001 0.01 0.1 1 10 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc operation in this area limited by r ds(on) 0 0.4 0.8 1.2 1.6 2 25 50 75 100 125 150 t a , ambient temperature ( o c ) i d , drain current (a)
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